The aim of the project is to define and implement a complete value chain for medium-infrared photonics (MIRPIC) chips, including a set of technologies and infrastructures necessary to undertake large-scale production of MIRPIC chips for applications in miniature sensor systems. The result of the project will be the first foundry in Poland and Europe offering the possibility of producing integrated photonics chips in the medium-infrared range on a high-volume scale. The main objectives of the project will be achieved through intensive research and development work carried out by VIGO Photonics with the participation of partners with expert competence in key areas covered by the project, i.e. technologies of detectors and sources of mid-IR radiation, PIC waveguide systems, heterogeneous integration technologies and optoelectronic packaging, mass testing techniques and the design of basic and composite functional blocks. This work, carried out as part of the RDI phase, will allow the definition and development of scalable manufacturing technologies and, consequently, the design of foundry and individual technological lines in their target shape, intended for implementation as part of the first industrial implementation phase (FID). Individual tasks include the development of individual technologies and, according to the Project Portfolio, focus on: 1) Development of scalable detector technology 2) Development of scalable MIR light source technology 3) Development of scalable passive waveguide chip technology 4) Development of active and passive component integration technology 5) Development of optoelectronic packaging technology 6) Development of mass testing techniques for photonic integrated circuits 7) Development of process design kit (PDK). After the completion of the RDI phase, two tasks of the industrial implementation phase 8) FID investment phase 9) FID operational phase are planned. The implementation of HyperPIC technology will allow you to replace expensive and complex systems with integrated circuits. As a result, it will be possible to use individual chips acting as a micro-laboratory in everyday devices (smartphones, household appliances, cars). In addition, it will enable the deployment of distributed networks of sensors and monitoring systems for industry, environment, agriculture, traffic and transport systems, critical infrastructure, etc. The target group of foundry customers/users and customers of integrated circuits manufactured in it will be companies operating on the market of broadly understood sensing, implementing solutions for applications in such areas as digital health monitoring (in consumer electronics systems), gas and liquid monitoring, automotive industry, modern agriculture, security and telecommunications (in free space). It is also planned to make the foundry potential available as part of MPW (multiproject wafer run) cycles for universities, research institutes and SME