Scientific manager of the project: Professor Oskars Ozoliņš, Riga Technical University (RTU). The interdisciplinary project ‘Energy-efficient and high-speed optical modulators for Artificial Intelligence Clusters (EMAICs)’ aims to develop energy-efficient high-speed modulators for data centre interconnections and long-range optical connections between data centres. The project aims to create small size energy-efficient electro-absorption modulators (EAMs) for dense optical chip interconnections with high-density wavelength division multiplexing (DWDM) channels and high-speed Mach-Zehnder modulators (MZMs) to overcome low data throughput - at the long-distance connection interface. The EMAIC project envisages the development of two types of energy-efficient, high-speed integrated photonics modulators, according to their intended use: short-range chips for optical interconnections in data centres; telecommunication optical interconnections between data centres.The first type of optical modulators will be developed on the silicon photonics (Silicon Photonics) platform using SiGe electro-absorption modulators (EAMs) designed for the development of compact devices in wavelength distribution sealing (WDM) systems with a large number of channels.The second type of modulators will be developed on the thin layer lithium niobate (TFLN) or lead lanthanum zirconium titanate (PLZT) platform using the Mach-Zehnder modulator (MZM) architecture, which is larger in size but provides higher performance.The two types of modulators will solve the problem of low data throughput in the optical interconnections of data centres. Main project activities (Work Packages – WP): WP1: Research systems and suppliers Explore semiconductor manufacturing capabilities to select suitable prototype suppliers. WP2: Circuit-level simulation and physical design layout Design and layout of integrated photonic circuits according to the process design kits (PDK) of the selected semiconductor manufacturing partners. WP3: Assembly and testing of demonstrators Construction and experimental demonstration of prototypes of integrated photonic devices. WP4: Protection of technology rights Protection of technology rights when filing a patent application. WP5: Dissemination of project knowledge and technology transfer Publication of results in industry-recognised scientific journals, participation in conferences, involvement of industry and society, conclusion of an intellectual property (IP) license agreement. WP6: Measures to ensure communication and visual identity requirements Involvement of the public and information about project results that are not protected by intellectual property rights. The Work Packages (WPs) are broken down according to the classification of activities as defined by the CFCA (see Activities) as follows: (1)Technically economic feasibility studies: this category of research is not applicable to this project. (2) Research involving at least one of the following research categories: fundamental research, industrial research; experimental development — WP1, WP2, WP3 3) Acquisition, validation and protection of technology rights (intangible assets) resulting from the research carried out — WP4 4) Dissemination of knowledge generated during the project in the form of training, publications or knowledge and technology transfer — WP5 5) Measures to ensure communication and visual identity requirements — WP6 Planned results. The EMAIC project will deliver the following key results (indicators): 1) Operational prototype of EAM/MZM optical transceiver chip. 2) Six (6) high impact scientific articles in international journals (SCOPUS Q1/Q2) and full text conference materials. 3) Patent application and conclusion of an intellectual property licence agreement. 4) A set of public engagement and information measures for the general public. 5) Increased innovation capacity in the Latvian ICT sector, promoting smart growth goals of the Smart Specialisation Strategy (RIS3) in the fields of ICT, photonics and smart materials The project will improve Latvia's technological competitiveness in the field of integrated photonics technologies, promoting further achievements in such sectors as telecommunications, security and health care. By promoting state-of-the-art SiPh, TFLN and PLZT integrated photonics technologies, the project will have a significant impact on future optical connection applications. As described above, it is clear that the objective and planned activities of the proposed project correspond to the economic transformation direction No 3 "Sectors with significant horizontal impact and contribution to the transformation of the economy" of the Latvian Smart Specialisation Strategy (RIS3) in the following areas of RIS3 smart specialisation: 1) Information and communication technologies; 2) Photonics and smart materials, technologies and engineering systems. The expected results of the project will contribute not only to RIS3 areas, but